The United States Department of State has introduced a visa bond pilot program, effective January 21, 2026, which requires Ugandan nationals applying for a B1/B2 visitor visa to pay a refundable bond. The bond, ranging from $5,000 to $15,000, equivalent to approximately Shs18 million to Shs54 million, aims to reduce the number of foreign nationals who overstay their visas.
Uganda is among the countries listed under the pilot program, along with Tanzania, Malawi, and Zambia. The visa bond will be determined on a case-by-case basis by a US consular officer and will be paid online through the US Treasury’s Pay.gov system. Applicants found eligible for a B1/B2 visa will be informed during their visa interview if they are required to post the bond.
A B1/B2 visa is a non-immigrant visitor visa issued for short-term travel to the US, covering activities such as business meetings, tourism, and social events. The visa does not permit paid employment or long-term study and is typically allowed for up to six months. The Department of State has cautioned that paying the bond does not guarantee visa issuance and that applicants should only make payment after being instructed to do so by a consular officer.
The bond will be cancelled and refunded if the visa holder leaves the US on or before the authorized period of stay. However, if a traveler overstays their permitted time or fails to depart within the authorized period, the Department of Homeland Security may refer the case to US Citizenship and Immigration Services to determine whether the bond conditions have been breached.
The new requirement is expected to increase the cost of visiting the US and create greater uncertainty for ordinary travelers. Travel agents have warned that the visa bond policy may significantly impact the travel plans of Ugandan nationals. The governments of the affected countries have yet to issue detailed public responses to the new requirement. The 12-month pilot program aims to assess the effectiveness of the visa bond in reducing visa overstays.
